Shay,

The resin blades typically come in two categories -
soft resin and hard resin. Try using the hard resin
blades (if you arent already using them). Also we have
used ~22 mciron blades with a spindle speed of approx
12k and a very slow feedrate of 0.05 inch/min for
dicing sapphire with minimal blade wear and chipouts.

Regards,
Adnan

--- Shay Kaplan  wrote:

>
> Hi everyone,
> I'm trying to cut sapphire wafers, ~300u thick, and
> I experience a very high
> blade ware - microns per cm cut.
> I'm using resin blades with ~45u size diamond and
> progressive cutting.
> Anyone has any experience with sapphire dicing? What
> blades, spindle speed
> and table speed should one use?