A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: About the Curing Profile of SU-8 100
About the Curing Profile of SU-8 100
2006-08-24
J.J wang
2006-08-24
g.balsubra manian
2006-08-24
Florian Herrault
2006-08-24
J.J wang
2006-08-25
Michael Riss
2006-08-25
Lung-hao Hu
2006-08-25
J.J wang
About the Curing Profile of SU-8 100
J.J wang
2006-08-24
Thank you all for your generous helps.

After the expose, PEB and developing, should I do some further bake ? Since I
the SU-8 100 to stay as the mechanical structure and  it needs to have some
robustness.

Thanks
J.J. Wang

Florian Herrault  wrote: Is it 250F or 250C ?
If it is celcius, it is way too high !
use a leveled hotplate and put your sample on it at RT. ramp it up to 95C for
about 4-5hrs and ramp it down ! wait for 1 hr, expose, postbake from 25 to 95
for 1 hr and ramp it down again. wait 3hrs and develop
200 um thick is not that thick. you should not have any problem with it !

florian
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Addison Engineering
MEMStaff Inc.
University Wafer
Mentor Graphics Corporation