Dear all
I'm trying to do a  through wafer etch (550um) using silicon Deep RIE.
I've tried with the AZ9260 photoresist. However, the reflow of the
photoresist after hard bake makes the etching profile non-uniform.

Does anybody know if metal can be used in the DRIE process. I've heard
that people have done 2mm etching using Ni as a mask. However, our
staff here says metal is not allowed in the chamber. It would be great
if anybody could give some references on that. Thanks a lot

Leo

Electrical and Computer Engineering
Purdue University
[email protected]