A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Metal mask for DRIE
Metal mask for DRIE
2006-08-31
Xiaoguang "Leo" Liu
2006-09-01
Florian Herrault
2006-09-01
Xiaoguang "Leo" Liu
2006-09-01
shay kaplan
2006-09-01
Hongjun-ECE
2006-09-01
Nicolas Duarte
2006-09-01
Nicolas Duarte
2006-09-01
Xiaoguang "Leo" Liu
2006-09-01
Hongjun-ECE
2006-09-01
gilgunn
2006-09-05
Pradeep Dixit
metal etching with the thickness > 30 um
2006-09-05
Feng-Yuan Zhang
Metal mask for DRIE
shay kaplan
2006-09-01
Use pecvd oxide
shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Xiaoguang "Leo" Liu
Sent: ה 31 אוגוסט 2006 23:24
To: General MEMS discussion
Subject: [mems-talk] Metal mask for DRIE

Dear all
I'm trying to do a  through wafer etch (550um) using silicon Deep RIE.
I've tried with the AZ9260 photoresist. However, the reflow of the
photoresist after hard bake makes the etching profile non-uniform.

Does anybody know if metal can be used in the DRIE process. I've heard
that people have done 2mm etching using Ni as a mask. However, our
staff here says metal is not allowed in the chamber. It would be great
if anybody could give some references on that. Thanks a lot


reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Mentor Graphics Corporation
University Wafer
The Branford Group
MEMS Technology Review