Thanks Florian
Do you have any idea how I can prevent the reflow in the post bake
process? Thanks
Best
Leo


On 9/1/06, Florian Herrault  wrote:
> optimize your photoresist process !!
> metal is etched in DRIE and contaminates the chamber.
>
> Quoting "Xiaoguang \"Leo\" Liu" :
>
> > Dear all
> > I'm trying to do a  through wafer etch (550um) using silicon Deep RIE.
> > I've tried with the AZ9260 photoresist. However, the reflow of the
> > photoresist after hard bake makes the etching profile non-uniform.
> >
> > Does anybody know if metal can be used in the DRIE process. I've heard
> > that people have done 2mm etching using Ni as a mask. However, our
> > staff here says metal is not allowed in the chamber. It would be great
> > if anybody could give some references on that.