A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: device passivation layer
device passivation layer
2006-09-05
Xiaoyong_Liu
2006-09-06
VS Bhat
2006-09-06
walter essinger
2006-09-11
Viswanadam, Gautham
device passivation layer
walter essinger
2006-09-06
Greetings,
Although 2771 is an older material it works extremely well.
good definition when patterned
We run hundreds of wafers using this and other HD materials.
Yes 350 is OK in nitrogen background gas.
Is your2771 dated/old or not kept refrigerated?
The final film should be hard /very tough
[email protected]
www.elume.com
----- Original Message -----
From: "Xiaoyong_Liu" 
To: 
Sent: Tuesday, September 05, 2006 1:29 PM
Subject: [mems-talk] device passivation layer


> Dear All,
>    I am making some of kind of  simple patterned wafer which will be used
> as test piece for our scanning sensor system. The requirement is that the
> sample needs to be protected by a passivation layer which is hardly able
> to be scratched since the sensor is in contact scanning. I tried to use
> SiO2 done by either PECVD or recative sputtering, but none of them works.
> I also tried photosensitive polymide material(PI 2771), but it is kind of
> soft aftere curing at 350C as suggsted by vendor. Does any one have any
> experience with that?
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Harrick Plasma, Inc.
Nano-Master, Inc.
Process Variations in Microsystems Manufacturing
Tanner EDA by Mentor Graphics