Dear Kim,
You can use Aluminium metallization by thermal evaporation and if your cell is
having the O-ring sealing then the HF soln. will not come to the back.
Sujatha


---------- Original Message -----------
From: "Jeehwan Kim" 
To: 
Sent: Wed, 6 Sep 2006 11:39:42 -0700
Subject: [mems-talk] HF resistance materials that have conductivity

> Dear all,
>
> I am fabricating micro-porous Si through anodization from the back
> side of wafer using HF-ethanol solution. The front surface becomes
> very rough after anodization. I need to protect this surface by
> depositing or spin coating something. The condition for protection
> layer is conductive and resistant to HF solution. Please let me know
> if you have any idea about these protection materials.