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MEMSnet Home: MEMS-Talk: SU-8 adhesion problem
SU-8 adhesion problem
2006-09-08
aeroalto
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Bill Moffat
SU-8 adhesion problem
aeroalto
2006-09-08
Hi all.

I am making a mold for electroplating Cu with SU-8 2015 on the glass wafer.

Until developing process, it looks there is no problem(SU-8 looks strongly
adhered to the glass wafer).

But when I electroplate Cu, the SU-8 mold layer is perfectly peeled off.

Do you have any idea why this happens?

Does SU-8 have adhesion problem with glass wafer?


Thank you.

aeroalto
[email protected]

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