Try HMDS using vacuum dehydration before HMDS. If you want, I can run
samples for you.
Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA  95131
(408) 954-8353


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of aeroalto
Sent: Friday, September 08, 2006 1:11 PM
To: [email protected]
Cc: [email protected]
Subject: [mems-talk] SU-8 adhesion problem

Hi all.

I am making a mold for electroplating Cu with SU-8 2015 on the glass
wafer.

Until developing process, it looks there is no problem(SU-8 looks
strongly adhered to the glass wafer).

But when I electroplate Cu, the SU-8 mold layer is perfectly peeled off.

Do you have any idea why this happens?

Does SU-8 have adhesion problem with glass wafer?