Hi All,

I am trying to etch 50nm Au/10nm Cr/1 um SiO2 using sputtered Ni as a masking
layer.
After ICP etching, I removed the remaining Ni using Transene Ni etchant TFB (or
Type I).
I found a thin layer on top of Au which is an insulating layer after the Ni was
removed.
Does someone know what this layer is and how to remove this layer? Thank you.


Eunki