Im not sure what you mean by interface problems. Most of these films are
MADE for interface to silicon wafers, but each with different
properties. For example, the Dupont PV202 silver paste is designed to
make a low R contact with silicon, but not appreciably penetrate any
oxide or nitride insulators. The PV147 silver paste is similar, but will
penetrate thin oxide or nitride insulators, but not penetrate any
appreciable depth into the silicon. The aluminum pastes generally will
penetrate insulators AND some depth into the silicon - buit that is a
property any aluminum will exhibit when heated to melting point
temperatures. These all need to be fired with a peak temp at least 675C.
The low temp pastes, such as epoxy and thermoplastics, are generally not
used for silicon interfaces, but I have used the epoxy on bare silicon -
you just have to be aware that there will be a thin oxide barrier which
can often be broken down with an initial small voltage pulse. Often used
as a simple interface for thermal silicon heaters, where modest currents
are needed anyway.
In general the fired pastes are better and lower R.

KSRC Murthy wrote:

>We have found that these thick film pastes are not compatible with silicon
>wafers. We tried to print and fire these materials on silicon wafers (On
>silicon surface, poly-silicon surface as well as Oxide surface)and we landed up
>with severe interface problems.
>
>Dr.Murthy KSRC