Hello All,
          I am planning to deposit Nickel Nanodots &
Gold microwire on same wafer. Nickel nanodots will be
deposited using PAA(Porous anodized alumina) technique
with nickel electroplating & I am planning to do gold
deposition using sputtering technique. However I am
not sure which one to go first & which one i need to
deposit at the last.

If any of you people have any information, please let
me know..

Thanks

Regards,
Madhav