Also, if your thickness is at all substantial, consider and electroless
plating process - it will start on a gold seed layer, and grows with low
stress.  Plated nickel can have a very high stress.

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of g.balsubra manian
Sent: Monday, October 16, 2006 3:39 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Nickel deposition technique!

For good thickness., you need to electroplate. For
good control over thickness (less thickness),u can do
either sputtering or evaporation.

For electroplating.,Ti or Cr Seed layer should be
either sputtered or evaporated.

Sputtering by e-beam should be better than thermal
evaporation as temp can be higher in the evaporation.

Regards

Bala