Hey thanks for the info,
                       however i am planning to
deposit nickel dots of 100nm diameter & thickness
200nm. So i am really clueless of evaporation method.
Does it get deposited in 100nm resolution pattern. I
am probably going for liftoff to remove the PMMA.

thanks

Regards,
Madhav

--- "g.balsubra manian"  wrote:

> For good thickness., you need to electroplate. For
> good control over thickness (less thickness),u can
> do
> either sputtering or evaporation.
>
> For electroplating.,Ti or Cr Seed layer should be
> either sputtered or evaporated.
>
> Sputtering by e-beam should be better than thermal
> evaporation as temp can be higher in the
> evaporation.