You are likely getting an enhanced deposition rate due to high field regions at
the edge of your features.  The work around for this is to do some pulse plating
with a short period of reverse bias.

-Michael Martin
 U. of Louisville


>>> "胡小东"  10/25/06 10:38 PM >>>

Dear All,
   In the past two months, while we did gold elctroplating, there were two gold
"wings" extending from the gold line onto the edge of photoresist.
   photoresist: AZ1500, 2.5 micron thick.
   gold thickness: 2 micron
   "wing" thickness: 3 to 4 micron
   "wing" width: 10 to 20 micron

   current density 5.5 mA/cm2
   electoplating time 13min
   PH value: 7
   temperature: 50 degree
   Has anyone experinced the same problem? May someone would give me any useful
suggextiongs. Thanks!

   Huxiaodong