=20
I'm not sure but I think this is caused by lack of agitation in the
bath. A local current density problem. I have seen this before and it
was very difficult to get rid of the problem. In the end we used ion
milling to knock of these upstanding features. Try agitation and playing
with the plating rate and possibly using robbers in the bath to get a
more even plating.=20

Regards,
=20
Steve Adamson
Market Manager, Asymtek
IMAPS President Elect 2007
=20
760-930-7274 office
760-802-1641 Cell
=20
Hope to see you at the Device Packaging Conference & GBC Spring Meeting
March 18-22, 2007, in Scottsdale, AZ
=20
=20
=20

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of ???
Sent: Wednesday, October 25, 2006 7:39 PM
To: [email protected]
Subject: [mems-talk] Gold were elctroplating onto the edge of
photoresist

=20
Dear All,
   In the past two months, while we did gold elctroplating, there were
two gold "wings" extending from the gold line onto the edge of
photoresist.
   photoresist: AZ1500, 2.5 micron thick.
   gold thickness: 2 micron
   "wing" thickness: 3 to 4 micron
   "wing" width: 10 to 20 micron
   =20
   current density 5.5 mA/cm2
   electoplating time 13min
   PH value: 7
   temperature: 50 degree=20
   Has anyone experinced the same problem? May someone would give me any
useful suggextiongs. Thanks!