Hi guys

I etched 1um of SIO2 with Cr mask in Oxford RIE.
But, after RIE I see some particles(which is called microloading) on
the SIO2 surface not the Cr surface.
I can't remove it with Acetone and O2 cleaning.
I have used only CHF3 gas for etching.
I may remove it with BOE but I am concerned it would etch not only
particles on bottome also sidewall.
Could you please tell me how to remove it?


Thank you