Hello,
We are looking for a gold contaminated Bosch process
for deep Si etching. We would like to perform the DRIE
on a Si-pyrex bonded stack. There are large cavities
in the silicon wafer (3mmX9mmx200um) that are sealed
with the bonded pyrex wafer. The sidewalls on the Si
cavity, as well as the pyrex cap, have 0.5um of gold.
We would like to DRIE the backside of the Si (to a
depth of 120um) to open the enclosed trench area, with
a 1:25 etch aspect ratio. I would appreciate any
suggestions about any Bosch process service providers.
Thanks,
--Kris
K. Vossough, Ph.D.
Nano and Micro Technology Consultants
E-mail: [email protected]
Voice: (408)373-5413
Fax: (650)798-5001
http://www.memswork.net
