Sebastian,

It depends on the degree to which you mean "without solvents", and the degree of
temperature resistance you need.

First, there are a series of thermal release tapes (two different brands -
Rexpan and Revalpha) with different grades of release temperatures from 90ºC to
170ºC.  They release very clean just from heat processing.  Keep in mind however
that these are thermal release materials - the safe operating zone is ~20
degrees below the release temperature.

A second option is Sekisui UV release tapes.  These have, overall, a greater
temperature resistance, but they do not appear to release as cleanly as the
thermal tapes.

Finally, there are a line of materials recently developed by Brewer Science in
conjunction with EVG.

These materials are spin on polymers which are also designed for a thermal
release (primarily slide-off).  There is no solvent required for the removal
process; however, there will be some residues that need cleaning following the
debond process.

A couple papers for reference:

H. Kirchberger, S. Pargfrieder, P. Kettner, C. Schaefer, "Production Proven
Temporary Bonding and De-Bonding Equipment and Technology," PROC. SEMI-ECS ISTC,
SemiCON China, March 15-17, 2005

S. Pillalamarri, C.Brubaker, M. Wimplinger, S. Pargfrieder, "High-Temperature
Spin-On Adhesives for Temporary Wafer Bonding," PROC. IMAPS 2006, San Diego,
Oct 10 - 12, 2006

Best Regards,
Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel:  480.727.9635, Fax:  480.727.9700  e-mail:
[email protected], www.EVGroup.com

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of Sebastian Sosin
Sent: Sunday, November 05, 2006 8:54 AM
To: [email protected]
Subject: [mems-talk] temporary bonding solutions


I am looking for a temporary bonding solution that can be removed without
solvents (heat, UV.). It may be glue or adhesive tape. Does anyone know any
products like this?