Hello,

Fusion bonding should work well.

First prebond the well cleaned wafers (nitric acid and KOH cleaning) at room
temperature by appliying slight pressure

If prebond is okay, put in a furnace for several hours (400 - 650 C )

--
Anil Agiral
PhD student
MESA+ Institute for Nanotechnology, University of Twente
Faculteit Elektrotechniek, Wiskunde en Informatica
BIOS, the Lab-on-a-Chip Group