Hi all,

Recently we met a problem on SU-8 adhesion. After a typical SU-8
process, the ENTIRE SU-8 film peeled off ALL AT ONCE from the Si
substrate when we developed it. We have dehydrated at 200C for 20
min before coating. For prebake and PEB, we tried both standard
length of time and the time 50% longer than the standard, but
neither worked. Could anyone help me crack this issue? Thanks a
lot.

Additional info: Wafer cleaned in Nanostrip for 3 hrs before
dehydration. SU-8 2050 spinned at 2500rpm. We used standard
exposure time, standard developer and IPA rinsing.

Best,

Bin