Hello all,

Can any one suggest an alternative method then a Cr intermediate layer that will
guarantee the adhesion of metals such as Au, Pt and in particular  Ag  to a
silicon substrate? I need a non metallic intermediate layer, such as a polymer.
Does any body know of a reagent (and its distributor) that will be suited to the
task. Preferably I am looking for a low curing (150oC) photosensitive polymer
but I am open to other alternatives.

MANY THANKS

Rónán O'Reilly,
ITT Dublin
Dublin
Ireland
Email: [email protected]