Laura:

  Most of the time people need to coat the wafer with some kind of antiadhesion
before casting PDMS because the bond between PDMS to Si is quite strong and
therefore you don't always need to modify the PDMS surfaces before bonding. If
you are to press the PDMS surface against the Si surface then bake them
overnight, you will find that they bonded just fine. To improve the strength of
this bond, you might want to clean the PDMS in diluted HCl solution before
bonding them. The said procedure is a reversible bond.

  H



  o: General MEMS discussion
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Dear all,

I want to bond my PDMS structure (with microfluidic chamber/ channels)
over a Si device. My question is how can I do activation without an
oxygen plasma dedicated equipment.
Can I use a sputtering machine? we have a sputtering with DC/RF source,
and it has a bias to perform the plasma over the substrate (it is used
to clean the surface before deposition). If yes, which gas do you
recommend me to use?