Prakash, I've experienced this myself. SU-8 delamination during
development can only be solved w/ better adhesion to the underlying
layer--process params will do little to improve the situation. I
purchased a Ti oxide (http://www.siliconresources.com/AP300.html) and it
worked very well. Surface roughening or metal deposition will also work.
Good luck.
-john@MNF