Some questions.
Any constraint on the thickness of the layer?
Do you think your problem is due to porosity of the metal allowing the
underlying Si to be attacked?
How long must the layer last?

Porosity may be reduced by avaporation onto a cold target so that the atoms
stay where they land. Also, a Au/Pd alloy gives a better coverage than Au.
Au atoms like clumping together to form islands. A thicker coating will
also obviously help. You could do this with a little bit of electroplating
which would also cover holes in the film.




>Hi,
>I am a PhD student working on a new electroless etch stop technique.
>Could you help me with the following problem:
>What kind of metal process do I need to get a gold layer on silicon
>which survives KOH or TMAH at high temperatures. We have tried
>evaporated Au/Cr but that comes of after a few hours?
>If you can help me please e-mail: [email protected]
>Thanks
>
>
>



Dr Alan Wilson
Defence Science and Technology Organization, Australia
               on attachment to the
       Center for Integrated Systems, Room 206X,
   Stanford University, Stanford CA 94305-4075, USA.

E'mail: [email protected]  ([email protected])

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