Usually one applies a point ANODE (- terminal of the power supply) to the
Pyrex to avoid trapping air.  However you should still be able to bond
successfully if a point contact is made to the Si with the + terminal.
Bonding won't occur unless the polarity is correct.

Roger Shile

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Daniela Kögler
Sent: Wednesday, February 07, 2007 2:01 AM
To: [email protected]
Subject: [mems-talk] anodic bonding of glass and si

Hi,

I tried to bond a glass (pyrex) and si wafer with 1000 V, 430°C and 30
minutes (point cathode), both wafer cleaned with acetone. Unfortunately it
did not work. There was only a vacuum between the wafers and it was
possible to separate them after the bonding.