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MEMSnet Home: MEMS-Talk: Shipley S1818 shrink/melt during hard bake
Shipley S1818 shrink/melt during hard bake
2007-02-17
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2007-02-19
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Shipley S1818 shrink/melt during hard bake
[email protected]
2007-02-17
Hi, I'm a graduate student at UC Berkeley. I used S1818 for high density
2um feature photolithography on Si wafer. The pattern looks great after
development with MicroDev. However, after hard bake in a 125oC oven for 30
min, the fine features turned into an area of mud/spagattii kind of mass.
Larger features, 100um lines, were still fine.

Does this mean my S1818 is bad? Or is this an intrinsic problem of S1818?
Should I reduce the hardbake temperautre and time?

Thank you!

Junyu Mai

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