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MEMSnet Home: MEMS-Talk: Problems with evaporating Titanium
Problems with evaporating Titanium
2007-03-02
Yue Mun Pun, Jeffrey
2007-03-02
David Nemeth
2007-03-02
Brent Garber
2007-03-03
Yue Mun Pun, Jeffrey
2007-03-03
Jon Fox
Problems with evaporating Titanium
Yue Mun Pun, Jeffrey
2007-03-02
Hi,
In my process, I am trying to evaporate Titanium on uncrosslinked SU-8.  The
purposes for the Titanium are:
1. To serve as a masking layer to protect the underlying uncrosslinked SU-8 from
further i-line UV patterning processes.  Thus, it has to be at least 25nm thick.
2. To serve as an adhesion layer for Gold, which will be e-beam evaporated on
the Titanium to a thickness of 200-300nm.

For Titanium as a masking layer, I am attempting to resistively or thermally
evaporate the Titanium to a thickness of 30-40nm.  However, this continues to
prove to be a challenge?  The evaporator I use is Edwards Auto 306 thermal
evaporator.  I use Titanium granules of <2mm size and Titanium is 99.5% pure.

Can anyone advise me how to go about evaporating the Titanium or can I use
e-beam evaporation of Titanium on uncrosslinked SU-8 2050.  E-beam evaporation
is much easier, in my experience.  However, the only concern is that e-beam
might cause undesired crosslinking of the underlying SU-8 2050.

Mr. Jeffrey Mun Pun YUE
Division of Bioengineering
Block E3, #05-18, Nanobioanalytics Lab
9 Engineering Drive 1
National University of Singapore
Singapore 117576
Tel: (65) 65165985, Fax: (65) 68723069
E-mail:  [email protected]
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