Sputtering can heat wafers by well over 50 C above ambient, depending on the
setup and recipe.
I've have polyethylene gloves melt when touching the platen holding the
wafers 20 minutes after deposition ended.

For both evaporation and sputtering, one method of limiting the temperature
rise is to deposit for a short time, allow cooling, and repeat.

You can get an idea of temperature rise by putting "temperature dots," which
are liquid-crystal material that permanently changes color upon heating past
a threshold, on the wafer.
Cover these with Kapton tape so that metal doesn't coat the dot itself,
which would prevent later viewing.
Poke holes in the tape with a razor blade to allow air to vent in the vacuum
chamber.

--Kirt Williams

----- Original Message -----
From: "Mantavya Sinha" 
To: "General MEMS discussion" 
Sent: Friday, March 02, 2007 7:50 PM
Subject: RE: [mems-talk] Depositing metals onto plastics and SU-8

You are right Roger. E-Beam is not going to be a cool process. In my
experience Sputtering should give you near room temperature (RT +
10'C-15'C) deposition.