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MEMSnet Home: MEMS-Talk: Dimples in SU-8 film
Dimples in SU-8 film
2007-03-20
Yue Mun Pun, Jeffrey
2007-03-20
Peng Li (Paul)
2007-03-20
Yue Mun Pun, Jeffrey
2007-03-20
Gareth Jenkins
2007-03-21
Yue Mun Pun, Jeffrey
PhotoResist - higher Glass transition temperature!!
2007-04-05
madhav rao
2007-03-20
Bill Moffat
Dimples in SU-8 film
Gareth Jenkins
2007-03-20
120C for 2mins may not be enough to fully dehydrate your wafer. I would
recommend 220C for at least 30mins.
Also, how are you cleaning the wafer prior to dehydration? I have
experienced dimples due to a contaminated H2SO4 cleaning solution.

Yue Mun Pun, Jeffrey wrote:
> Hi,
> I am trying to coat 2-3 layers of SU-8 2050.  My process is aas follows:
>
> 1.  Dehydration bake SiO2 wfr at 120'C for 2mins
> 2.  Spin coat SU-8 2050 at 500rpm and ramp up to 3000rpm for 30sec.
> 3.  Soft bake the first layer at 65'C for 3mins (ramped from 50'C to 65'C and
hold for 3mins)
> 4.  Return wafer to spin coat another layer at the same conditions stated in
2.
> 5.  Soft bake wafer at 65'C for 5mins and ramp to 95'C for 20mins, since the
layers now have a nominal thickness of 100 microns.
>
> I noticed that while baking at 95'C the SU-8 film developed dimples.  These
may or may not be an issue for my process, but they are cosmetically ugly.  Can
anyone tell me how do I solve this dimple issue?
>
>

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