Hi,
I also work with the polyimid PI-2574.
I cured the polyimid at 110 degrees 3 minutes and it got etched and
transferred the pattern of a second photoresist layer. Unfortunately the
polyimid lost the adhesion to the si-wafer by the removal of the
photoresist.

I tried to cure the polyimid at 160 degrees; unfortunately it did not get
etched with the photoresist.

Is there a chance to etch the polyimid with photoresist developer AND remove
the photoresist afterwards?

Thanks a lot in advance.
Dan


-----Ursprüngliche Nachricht-----
Von: [email protected] [mailto:[email protected]] Im
Auftrag von Jason Milne
Gesendet: Mittwoch, 21. März 2007 04:26
An: 'sheeja mathew'; 'General MEMS discussion'
Betreff: RE: [mems-talk] polyimide

Hi Sheela,

In my research group, we use HD Microsystems PI-2616 as a sacrificial
layer for MEMS release. We have measured the complex refractive index to
be n + i*k = 1.69 + i*0.0001 at a wavelength of 1400nm, and have
measured k to be less than 0.001 from 1.2 micrometer to 2.3 micrometer.

We partially cure our polyimide on a hotplate at 130 degrees for 15
minutes, to ensure that we can still wet release it in photoresist
developer- so for your application, the polyimide will get etched and
transfer the pattern of the photoresist.