Go directly from the Ni plating to Di rinse to Gold plating with no dwell
in air in between (keep the wafer wet all the time).. this sill prevent Ni
oxides from forming.  Also Au will immerse onto Ni, so make sure the
plating power is applied immediately when immersed in the gold bath...
good luck..

Bob Forman | Business Manager, Advanced Packaging
Rohm and Haas Electronic Materials | Packaging and Finishing Technologies
10414 78th ave NW | Gig Harbor, WA 98332| Phone: 425-785-9817 |
http://electronicmaterials.rohmhaas.com


"P.E.M. Kuijpers" 

Subject [mems-talk] Au plating on Ni layer

Dear all,

What kind of pre treatment of the Ni layer must I use to obtain a good
adhesion of the plated Au layer??
Ni was plated using a NiCl solution, Au was plated using Aurofab BP, but
adhesion was very bad.
Thanks,

Peter Kuijpers