A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Thick SiO2 etch
Thick SiO2 etch
2007-04-19
Xiaoguang "Leo" Liu
2007-04-20
Shao Guocheng
2007-04-20
VS Bhat
2007-04-20
P.E.M. Kuijpers
2007-04-20
Roger Brennan
2007-04-20
Joe Lonjin
Thick SiO2 etch
Xiaoguang "Leo" Liu
2007-04-19
Dear all

For one of my projects, I need to pattern thick thermal oxide of
1.5um. I used 49%HF:DI = 1:6 as the etchant and 20um AZ9260 as a mask
(the reason of using this thick resist is that I need to do a through
wafer Deep RIE after patterning the SiO2).

The etching of the oxide takes more than half an hour in the etchant.
My problem is that the photoresist can not stand the HF solution and
start to peel off (especially the smaller features) after about 20min.
HF also attacks the photoresist reducing the overall thickness of the
photoresist, which can impact my later DRIE process.

Could anybody illuminate me with a better method to etch the oxide
layer without destroying the photoresist? I greatly appreciate your
help.

Best
--
Xiaoguang "Leo" Liu
Birck Nanotechnology Center
Purdue University
[email protected]
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
MEMS Technology Review
University Wafer
Tanner EDA by Mentor Graphics
MEMStaff Inc.