The most helpful paper I've found on this subject is DESIGN AND
FABRICATION OF A THZ NANOKLYSTRON by Harish M. Manohara and coworkers
from JPL.  I don't know where it was published, but you can find it with
Google. Martin Schmidt from MIT has also published several papers on
wafer-level Gold Thermocompression Bonding

I have the book that you mentioned.  I must warn you that it deals
almost exclusively with fusion or direct bonding and contains nothing on
Gold Thermocompression Bonding.

Roger Shile

-----Original Message-----

Hi,All,

    Would someone give some useful references on gold-gold thermal
compress wafer bonding?
    I'd like to bonding wafers by this mean. There is a book named
"semiconductor wafer bonding: science and technology". I'm buying it,
but it will takes months for us to get the book.
    So any electronic version paper on the subject?
    Thanks!
                               Hu Xiaodong
                               [email protected]
                               Hebei Semiconductor Research Institute