Jeffrey,
        Here goes.  The secret of image reversal as a tool for lift off
is you can profile the resist side wall to present a reversal angle that
metal will not deposit on.  Using negative resist does not achieve this.
If you want to run some free experiments contact me.  Suggest the
following process:-
1) Coat SiO2 with any positive resist spun to any thickness.  We have
used from 1 micron to 40 microns.
2) Soft bake preferred 90 degrees C in a vacuum.  Any temperature over
90 starts to destroy the sensitizer and the critical dimensions suffer.
3) Expose at 405 nM near UV light intensity of 7.5 mW/cm2 for about 6
seconds.
4) Reversal bake at 90 in an ammonia YES oven for 45 minutes. The
ammonia will diffuse through the resist and neutralize the acid created
by exposure.
5) Flood expose same intensity, 6 seconds will give you a negative
slope. 9 seconds will give you 90 degrees vertical, 12 seconds will give
you about 20 degrees negative slope.
6) Develop in positive developer not too strong not too hot.
7) Deposit metal.

   Using above you can achieve 0.1 micron C.D. with better than 5%
uniformity or with thick resist vertical side walls for metal plating
control.  Repeatable reliable and in use in production around the world.
You do all steps except 4) ship to me will do 4) and ship back.  Contact
me for technical papers.

Bill Moffat, CEO
Yield Engineering Systems, Inc.
203-A Lawrence Drive, Livermore, CA  94551-5152
(925) 373-8353
[email protected]
www.yieldengineering.com