A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Tungsten adhesion probelm
Tungsten adhesion probelm
2007-05-23
shimul saha
evaporated zinc
2007-05-23
Joseph Grogan
2007-05-24
Ivan Shubin
2007-05-24
Kirt Williams
Tungsten adhesion probelm
shimul saha
2007-05-23
Hello,

We are DC sputtering Tungsten on SiO2. But the tungsten fells of after dry
etching tungsten , or during nitride deposition afterwards (high temp process).

We are using DC sputterng at 7500 watts. The stress in the film is around 2 GPa
compressive. The thickness of the film is 0.5 um.

Can anyone please give us some hint how we can improve the adhesion (to oxide)
or have a low stress tungsten so that the metal can survive afterward high temp
process.

Thanking you.

Best regards,
Shimul Chandra Saha
IET/NTNU (SINTEF MiNa Lab)
Trondheim, Norway.
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Addison Engineering
Mentor Graphics Corporation
The Branford Group
Harrick Plasma, Inc.