Hello,

We are DC sputtering Tungsten on SiO2. But the tungsten fells of after dry
etching tungsten , or during nitride deposition afterwards (high temp process).

We are using DC sputterng at 7500 watts. The stress in the film is around 2 GPa
compressive. The thickness of the film is 0.5 um.

Can anyone please give us some hint how we can improve the adhesion (to oxide)
or have a low stress tungsten so that the metal can survive afterward high temp
process.

Thanking you.

Best regards,
Shimul Chandra Saha
IET/NTNU (SINTEF MiNa Lab)
Trondheim, Norway.