Hi all,
   In Tsau's paper, in pre-bonding cleaning for Au-Au thermocompression bonding,
to ensure removal of organics, the substrates were exposed to UV-ozone for 90
min immediately prior to wafer alignment. But we don't have that equipment.
   So, my question is:
   Would dipping into Piranha be helpful? (Since it can remove organics.)
   Or should O2 plasma cleaning be better? (Since it can remove organics too.)
   Thanks!
                                           Hu Xiaodong
                                           [email protected]
                                           Hebei Semiconductor Research
Institute