Possibly plasma to roughen the surface.  A forming gas plasma will
remove copper oxide also.  Or a CVD deposition with specific chemistry
that will match the SU8 surface tension exactly.  Contact me for more
technical data.  A common use for our 1224 is for adhesion of LCD layers
to ITO.

Bill Moffat, CEO
Yield Engineering Systems, Inc.
203-A Lawrence Drive, Livermore, CA  94551-5152
(925) 373-8353

[email protected]

www.yieldengineering.com

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Zhang Xiao Qiang
Sent: Tuesday, July 03, 2007 1:39 AM
To: [email protected]
Subject: [mems-talk] pure adhesion between SU8 and Cu

Dear colleagues

I met pure adhesion between SU8 and Cu seed layer, it peels off or hump
locally when I plate NiP through SU8 pattern. Anyone have solutions for
this problem?

I am trying to use ITO seed layer. Do you think it is ok? Will ITO react
with the H3PO4 or H3PO3 in the plating bath?