Hello Everyone,

We are designing a MEMS shear stress sensor which needs to be flush mounted
in a wall. It has through wafer interconnects and gold electrode pads
deposited on the backside.  I am looking for techniques for connecting the
packaging to the 800um x 800um electrode pads on the backside of the device.
The devices have already been released so I cannot touch most of the front
side of the device as the free-standing structures definitely will break.

To make the connection,  I would prefer to use a method other than wire
bonding. My main attempt so far has been to use silver epoxy to attach small
wires to the pads by resting the device on top of the wires and curing the
epoxy with a heat gun.  I have had mixed results with this.

I would appreciate if anyone could lend any advice, or point me to any
literature about this.

Thanks,
Andrew O'Grady
[email protected]
212-854-7306
PhD Candidate
Mechanical Engineering Department
Columbia University
Mudd Building
500 West 120th Street
New York, NY 10027 USA