Dear all:
  There is a problem for me to do the bonding with gold on the aluminum
metal film,and the substrate is GaAs, the top cap layers are:
CdMgTe,CdMnTe, CdHgTe,CdTe and ZnTe, respectively. The thickness of the
deposited Aluminum is 300nm,the radius of the gold wire is 25
micrometers. Is there anybody who can give a suggestion about this
bonding technology?
Thanks very much!

Chen,Yuansen


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Universität Duisburg-Essen-Standort Duisburg
Abteilung Elektro-und Informationstechnik
Werkstoffe der Elektrotechnik(WET)

Chen,Yuansen
BA 119
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Germany

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