Dear MEMS Community,

I am in the process of fabricating microdisk cavities. In order to get a
vertical side wall, I am using the Trion RIE to dry etch GaAs/AlGaAs laser
structure. The recipe is as follows (13 sccm BCl3: 3 sccm Cl2). The ICP power
is 150 and the RIE power is 50. I can't increase the RIE power because the
photoresist (S1813) gets carbonized during the etching process. I have tried a
thermal paste called "MONG" and still have some problems with my photoresist
getting carbonized. In addition I also have problems with getting a vertical
side walls.

Any suggestion is highly appreciated...

Yours truly,

Ali