I am also looking for a recipe to etch 10um deep polymer with vertical wall
profile(linewidth~8um with Al or NiCr mask, spacing~250um) with SF6/O2/CHF3 gas
chemistry using "Oxford Plasmalab 80 plus" system. If any one has any kind of
recipe or research paper please let me know.

Michael D Martin  wrote:  I would increase flow
rates to reach a pressure of 100-200mT and boost power to 250-350W. The white
powder is likely sputtered silicon /silicon dioxide redeposition. You might
consider running a cleaning cycle before processing. It's been our experience
that this improves repeatability, particularly for a multiuser piece of
equipment.


Pramod Gupta
21084 Red Fir Court
Cupertino, CA 95014
Phone: (408) 253-1646