Hi Uppuluri

I'm not sure about the selectivity of photoresist in the etcher, but I
think you can probably try a thick resist, say 20-40um .

Best
Leo

On 10/1/07, Sreemanth M Uppuluri  wrote:
> Hello All,
>
> I am trying to etch quartz by Deep-RIE process. The etch depth I need is
> around 10 microns. Can anyone please suggest a recipe for this. I have tried
> using Cr/Ni mask (Ni thickness of 70 nm) with CF4. But nickel got etched
> very fast and the maximum etch depth obtainable is around 1.5 microns.

--
Xiaoguang "Leo" Liu
Birck Nanotechnology Center,
Purdue University,
1205 W.State Street, West Lafayette, IN, 47906 USA
[email protected]