Hi all,
for my application i need to dice silicon strips of size 20x70mm. Starting
material is (110) silicon wafer 0.5mm thick.

Dicing induces lattice damage. Using etch pitch dislocations etchants i
determined that there is a strong damaged zone near the cut, damaged zone
extend for a thickness of about 100um, and decrease far from the cut.

I know that thermal cycles are used to remove lattice damage and improve
lattice quality, but i don't have any experience in this field.

Could thermal cycles be useful for removal of lattice damaged induced in
dicing operations ? Any suggestion or starting point ?

Best regards,
Andrea