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MEMSnet Home: MEMS-Talk: fudging/spreading around the PR features
fudging/spreading around the PR features
2007-10-05
Sadhana Patil
2007-10-05
Edward Sebesta
2007-10-06
Sadhana Patil
NC-200
2007-10-07
Andrea Mazzolari
2007-10-08
Edward Sebesta
Lithographic Tests masks for the EVG620
2007-10-12
Edward Sebesta
2007-10-05
Andrea Mazzolari
2007-10-05
dbp lists
2007-10-06
Andrea Mazzolari
2007-10-06
shay kaplan
Sapphire stiffness matrix
2007-10-07
Andrea Mazzolari
2007-10-06
[email protected]
fudging/spreading around the PR features
Andrea Mazzolari
2007-10-06
Here is the procedure i follow for patterning of silicon or silicon nitride:

1) standard rinse and clean
2) spinning of microposit primer (0.5ml)
3) spinning of S1813 (4500 ml)
4) soft bake (3 min at 115 °C)
5) exposition (150 mJ)
6) develop
7) hard bake (3 minutes at 115 °C)

Best regards,
Andrea

> I am new to Photolithography. I am doing Photolithography with S1813.
> Many a times I get fudging/spreading of photoresist around the edge of


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