Hafizah:

I don't know about bonding but if you want to selectively remove nitride
from the backside just pain photoresist on the areas you want to remain as
thin as possible bake at 90 degrees centigrade in an oven then plasma etch
using florine in a plasma etch system. Bob Henderson
----- Original Message -----
From: "Nor Hafizah Ngajikin" 
To: 
Sent: Monday, October 29, 2007 9:12 PM
Subject: [mems-talk] SiN/SiN bonding and substrate etch

>
> I have a question on how and what material can be used to bond SiN (wafer
1) with SiN (wafer 2). Secondly, does anybody know what process can be used
to totally remove a part of back side Si Wafer without affecting the SiN
layer  at the front side.