Dear Nam et al.,

I've obtained (link to journal article below) a much improved process lift-off
for fabricating thin film devices (compared to conventional lift-off) down to 3
micron line features (with Karl Suss MJB3 mask aligner in proximity mode) using
image-reversal (negative sloping resist sidewalls) with AZ5214E and AZ
developer:

http://www.iop.org/EJ/abstract/1742-6596/92/1/012180

Best regards,

Thomas E. Wilson
Professor of Physics
Marshall University
Science 154
One John Marshall Drive
Huntington, WV  25755-2570

Tel: 304.696.2752
FAX: 304.696.3243