I have 200-400 nm thick SiO2 thin film grown using PECVD-RIE machine. Now I
need to etch the SiO2 thin film at the same machine to get patterned SiO2
hard mask. I only have CF4 and SF6 gases in the machine. Could I get some
advices on dry etching SiO2 to get patterned hard mask. Also I need what
kind pf PR I should use on top of SiO2.

Sincerely Yours

Alim Polat, PhD student
ITN, Linkoping University
Sweden