Hello Elina,

1. I'd suggest, that you saw your dies prior to making the cantilever
beams free (underetching the sacrificial layer, or whatever you do).
Then simply process your dies separately.

2. This approach, however, works well only in case your dies and beams
have relatively big dimentions (otherwise you naturally will have to
work with too many units).

If they are very small, than you possibly could temporarily cover your
prepared wafer with some transparent organic material which will
protect the beams, saw the wafer, and finally remove this protective
material.

Regards,

Denis Petrov