Hi Elina,

If your substrate is single crystal silicon, you can try the so-called "stealth
dicing" developped by Hamamatsu photonics. In this method, you produce crystal
defects using IR-laser WITHIN the substrate. The chip separation is done by
stretching the dicing tape subsequently. This method is free of water, dust,
mechanical stress and edge chipping, thus ideal for dicing the chips with
fragile structures like cantilevers or membranes.
For more info, see the link below.

http://jp.hamamatsu.com/products/semicon-fpd/pd393/L9570-01/index_en.html


Best regards,

Natsuki


-----Ursprüngliche Nachricht-----
Von: [email protected] [mailto:[email protected]] Im
Auftrag von Ir. Elina Iervolino
Gesendet: Sonntag, 10. Februar 2008 13:00
An: [email protected]
Betreff: [mems-talk] Cantilever sowing

Hello!

I have  wafers with cantilever that need to be sowing to obtain the
single die.
I tried with one but all the cantilever do not survive because of the water
flushing
on the wafer
Do anyone have experience with the sowing of the wafer with cantilever?